ICPST-42 (2025) PANEL DISCUSSION
Topics: What’s Next for Materials Research in Device Manufacturing?
Unlocking Next Wave of Innovation: AI, Sustainability, Scaling and 3D Integration
Facilitators: Seiji NAGAHARA (ASML Japan) , Takeo WATANABE (University of Hyogo)
18:00-20:00, Wednesday, June 25, 2025 at Medium Hall (693 seats) at Arcrea Himeji
Panelists:
Dr. Jos Benschop ( ASML): High NA/Hyper NA EUV and next challenges in materials
Dr. Danilo De Simone (IMEC): EUV resists/process, sustainability
Mr. Ethan Choong Bong (CB) Lee (Samsung SDI): Material development trend in semiconductor industry, PFAS free materials
Prof. Teruaki Hayakawa (Institute of Science Tokyo): DSA and new materials trend
Prof. Kenji Yoshimoto (Kanazawa University): AI/Digital Twin/MI
Dr. Toshiyuki Ogata (TAIYO HOLDINGS): Chiplet Integration
The purpose of discussion: To find out the evolution and challenges in future materials research.
Opening (explanation of the panel discussion topics) 5 min
5-10 min presentation for each panelist including Q&A (Total 1 hour)
Free discussion with the panelists (20 min)
Topics examples (tbd):
What are the most critical performance metrics for EUV resist materials in high NA EUV era?
How do you see trade-off between LER/LWR and sensitivity evolving?
What are the use cases of DSA for device manufacturing?
What will happen in the movement in sustainability?
How to use materials informatics and AI for future materials development flow?
What is the exciting research area in 3D integration?
What do you see the biggest gaps or opportunities for cross-functional collaboration?
What can be a good function of ICPST or requests to ICPST?
On site discussion among audience (two or three parsons discussion, Carousel style): (30 min)
10 min discussion and 20 min presentation from audiences
Closing Remarks: Highlight few takeaways from discussion (5 min)
Panelists biography:
Jos Benschop (ASML)
Jos Benschop currently serves as Executive Vice President Technology, ASML, the Netherlands. He received the M.Sc. (cum laude) and Ph.D. degrees from the Physics Faculty, Twente University. His career in semiconductor technology began at Philips Research (Eindhoven, NL, and Sunnyvale, USA) from 1984 to 1997. In 1997, he joined ASML as Head of Research. Since then he has lead research for paving the way for the commercial semiconductor device production using EUV lithography. He is an SPIE Fellow and Fellow of the Netherlands Academy of Engineering. He has been appointed by the Dutch King as an Advisor to the Dutch Government on Science, Technology and Innovation.
Danilo De Simone (imec)
Danilo De Simone is scientific director at imec. He has 25 years of experience in the semiconductor R&D field and his work has produced over 150 scientific and technical papers in the field of lithographic materials and advanced patterning. Before imec, he worked for the industry for STMicroelectronics, Numonyx and Micron Technology. He is editorial board member of the Journal of Micro/Nanopatterning, Materials, and Metrology (JM3), member of SPIE committee for the Patterning Materials and Processes program and member of the International Advisory Board of the Photopolymer Science and Technology Conference (ICPST).
Ethan Choong Bong (CB) Lee (Samsung SDI)
Ethan CB Lee is Vice President and Adv. Patterning Technology Director at Samsung SDI. He has over 25 years of experiences in the semiconductor materials, especially on lithography patterning materials and process development. He made outstanding technical contributions to the industry as a global technology leader on lithographic materials area since 2002 and also a business strategy specialist representing both technology marketing and sustainability program on lithography field covering GHG and PFAS reduction, while leading collaborations with global semi industrial partners and government offices from many countries in Europe and USA beyond 2021. He worked at DuPont E.I. Semiconductor Business (2006.Nov. - 2024.May) after DuPont EM Photomask (2004-2006), DongJin Semichem (2002-2004) and Yonsei Univ. Graduate School located in Seoul, Korea.
Teruaki Hayakawa (Institute of Science Tokyo)
Teruaki Hayakawa is a Professor in the Department of Materials Science and Engineering at the Institute of Science Tokyo. He received his B.Sc. (1995), M.S. (1997), and Ph.D. (2000) degrees from Yamagata University, specializing in polymer materials science and engineering. From 1997 to 1998, he was a visiting student at Cornell University. In 2000, he joined the National Institute of Advanced Industrial Science and Technology (AIST) as a researcher. He moved to Tokyo Institute of Technology as an Assistant Professor in 2003, was promoted to Associate Professor in 2009, and became a Full Professor in 2017. His research focuses on directed self-assembly block copolymer materials, low dielectric loss polymers, high thermal conductivity epoxy materials, and wholly aromatic condensation polymers. He also serves as an Associate Editor for Materials Today Chemistry.
Kenji YOSHIMOTO (Kanazawa University)
Kenji Yoshimoto is an Associate Professor at the Advanced Manufacturing Technology Institute, Kanazawa University, Japan. He received his Ph.D. in Chemical Engineering from the University of Wisconsin–Madison in 2005. After a postdoc at the Scripps Research Institute (2006-2007), He worked at AMD and GlobalFoundries (2008-2012) on the next-generation lithography including EUV and DSA, followed by Kyoto University (2012-2019), where he developed practical DSA models. At Toray Industries (2019–2023), he led digital transformation in materials R&D. His current work at Kanazawa University (2024-current) focuses on multiscale simulations of polymer materials and processes for semiconductors and membrane applications.
Toshiyuki Ogata (TAIYO HOLDINGS)
Toshiyuki Ogata has been serving as the project leader for the 3D packaging materials project at the Research Division of Taiyo Holdings Co., Ltd. since 2022, where he is responsible for marketing in the next-generation semiconductor packaging materials market. His career in semiconductor technology spans 28 years, during which he has played a significant role in the development of semiconductor photoresists as well as process materials for both front-end and back-end processes. Prior to joining Taiyo Holdings, he worked at Tokyo Ohka Kogyo Co., Ltd., and from 2007 to 2011, he was a visiting researcher in the Willson Research Group at the University of Texas at Austin.
Facilitators biography:
Takeo WATANABE (University of Hyogo)
Takeo Watanabe received his Ph.D. from Osaka City University in 1990. He is now the Principal Investigator of Next Generation EUVL Research Endowed Chair, the Project Professor of Laboratory of Advanced Science and Technology for Industry (LASTI), University of Hyogo. Previously, he was assigned as a special advisor to the president, director of the Center for EUVL, and Dean of LASTI, at the University of Hyogo. He is an expert of the EUV lithographic technology, including optics, exposure tool, mask, resist, and pellicle etc., and contributes with EUVL and next generation EUVL fundamental researches. He has authored over 270 technical papers, and he is the president of the International Conference of Photopolymer Science and Technology (ICPST). He is also Conference Chair of the International Conference of Photomask Japan (PMJ). He is a program committee member of the International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIPBN). Furthermore, he is a committee member of lithography of IRDS.
Seiji NAGAHARA (ASML Japan)
Seiji Nagahara is Head of Technical Marketing at ASML Japan. Previously, he held key roles at Tokyo Electron Ltd. (TEL), Renesas Electronics and NEC, focusing on next-generation lithography and tool/process development. His career includes collaborative research with institutions like Toshiba, IMEC, UC Berkeley, Argonne National Laboratory, and EIDEC. He holds a Bachelor's, Master's, and Ph.D. degrees in Engineering from Osaka University, Japan. He is SPIE Fellow and also holds positions in several academic and technical societies. He is serving as Vice President and Board Member of the Society of Photopolymer Science and Technology (SPST).
Medium Hall (693 seats) at Arcrea Himeji
