Journal of Photopolymer Science and Technology (JPST), which has been published by The Society of Photopolymer Science and Technology (SPST), celebrates its 30th anniversary last year. The editors would like to express their sincere thanks to all authors as well as the readers for warm and sustained supports for this long term of the publication of this Journal.
Advances in technologies of 'the Internet of things' (IoT) and 'information technology' (IT) are due to major advances in semiconductor technology, enabling semiconductor integration by advanced lithographic technologies. The advancement of lithography has been supported by the resist material processing technology, which improves the electronic performance of semiconductor devices such as high speed, low power consumption, integration of ultra large scaled circuits, and reduction of manufacturing cost.
The International Conference of Photopolymer Science and Technology (ICPST) organized by SPST for these 34 years has played an important role as a forum for discussion and information exchange on the resist material process technology used in various lithographic technologies such as g-line, i-line, KrF, ArF, electron beam, and X-ray. ArF immersion lithography is currently used for 22-nm-generation semiconductor manufacturing technology. In addition, EUV lithography, nanoimprint lithography, and DSA technology are promising candidates for semiconductor nano-fabrication technologies in next 7-nm and 5-nm generation and beyond. At the International Electron Devices Meeting (IEDM) 2016, several chip manufacturers reported that EUV lithography will be used for the mass production of logic semiconductor devices.
For supporting the future IoT technology, advanced techniques of the lithography are required increasingly, where material technologies such as photo-functional groups, photo-acid generators, photo-curable resins, etc. are the driving force for the progress of semiconductor technology with quantum scale and quantum effect. Basic research on photopolymer is more significant in developing new technologies such as quantum device technology with lower power consumption and lower manufacturing cost by combining with life science and quantum device technology.
All the science and technology related to photopolymer technology must be focused for further progress of ICPST. New Symposia will continue to be provided in place of conventional ones. The international symposium of Organic Solar Cells – Materials, Device Physics, and Processes was added in 2015. In addition, the international symposium of Fundamentals and Applications of Biomimetics Materials and Processes was added last year.
Constructive opinions from researchers and scientists are welcomed for future progress of ICPST.
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
Home Page http://www.spst-photopolymer.org
Journal of Photopolymer Science and Technology is a peer-reviewed journal published papers on the scientific progress and the technical development of photopolymers biannually in June and December.
Editor-in-Chief and Founding Editor: Minoru TSUDA, SPST & Chiba University
Editor-in-Chief: Haruyuki OKAMURA, Osaka Prefecture University
Editor: Masayuki ENDO, Osaka University
Etsuo HASEGAWA, SPSJ Fellow
Yoshihiko HIRAI, Osaka Prefecture University
Hideo HORIBE, Osaka City University
Takanori ICHIKI, University of Tokyo
Takashi KARATSU, Chiba University
Masayuki KUZUYA, Chubu Gakuin University
Seiji NAGAHARA, Tokyo Electron Ltd.
Tomoki NAGAI, JSR Corporation
Itaru OSAKA, Hiroshima University
Shu SEKI, Kyoto University
Masa-aki KAKIMOTO, Tokyo Institute of Technology
Takumi UENO, Shinsyu University
Takeo WATANABE, University of Hyogo
International Advisory Board
Robert D. ALLEN, IBM Almaden Research Center
Ralph R. DAMMEL, AZ Electronics Materials
Christopher K. OBER, Cornell University
C. Grant WILLSON, The University of Texas
The Editorial Office
Assoc. Prof. H. OKAMURA
Department of Applied Chemistry,
Osaka Prefecture University,
1-1 Gakuen-cho, Naka-ku,
Sakai, Osaka 599-8531, Japan.
Important information: Date of publication of Vol. 32, No. 1 ~ 5 is June 24, 2019.