ICPST Tutorial Session

Basics of Lithography Materials Science and Technology 

 

ICPST and TAPJ are plannnig to provide opertunity to learn advanced materials processes for semiconductor manufacturing. The detail will be annouced later.  The leading edge speakers are being invited.

 

 Tuesday, June 24, 2025 at Medium Hall (693 seats) at Arcrea Himeji

 

TUTORIAL Session ORGANIZERS 

SEIJI NAGAHARA (ASML Japan), HARUYUKI OKAMURA (Osaka Metropolitan University)

 

Purpose of TUTORIAL SESSION

 

For the semiconductor industry’s scientists and engineers, this program provides an opportunity to learn the fundamentals of lithography materials science and technology.

 

半導体業界の人材育成の一環として、リソグラフィー材料に関する科学と技術の基礎を学ぶ機会を提供する

 

 

 

Target AUDIENCE of TUTORIAL 

 

University students who are considering related company for a future job

 

Lithographers/process engineers /material engineers in semiconductor companies, materials/equipment suppliers

 

Scientists who work for the related science and technology 

 

 

 

Resistration

 

The attendees of ICPST and members of TAPJ can join this tutorial session with free of charge. Tutorial materials will be shared with the attendees from web site if speakers' permission is obtained. The detail will be announced later. 

 

 

 

LANGUAGE of the TUTORIAL SESSIOn

 

The tutorial will be given by English or Japanese. The language in the slides will be English.

 

 

 

TOPICS (TBD)

 

  • Lithography industry general introduction
  • Lithography technology general introduction
  • i-line resist
  • KrF/ArF/ArFi/EUV/EB chemically amplified resistPTDNTD, developer
  • Photo acid generators (PAG) and photo decomposable base (PDB) 
  • Metal containing resists 
  • Resist filtering technology 
  • BARC, SOC, TC, MHM, rinse, shrink materials 
  • Packaging materials 
  • Special keynote talk: Device related tutorial and material application